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| IC280 Series (Clamshell) Specifications Ball Grid Array (FBGA / CSP / LGA) Part Number (Details) 1,000MW min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch 100m W max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: -40C to +150C 15g~35g per pin within contact travel Contact Force: distance between 0.2~0.5mm 10,000 insertions Mating Cycles: IC280 Series No. - 576 06 (.AC...) No. of Contact Pins Design Number For Pin Depopulation and Custom Designed Sockets Materials and Finish Housing: Polyethersulphone (PES), glass-filled and Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features i V-shape contact structure to lower the damage of coplanarity of solder balls i Available in 3 pitch sizes and various depopulation versions, please contact Yamaichi for further available pin counts or custom sockets Outline Socket Dimensions Contact Details for BGA B C A Contact Details for LGA Socket Side Views Dual Lid Type (DL) Clamshell Type (CS) Part Number IC280-169-127 IC280-196-126 IC280-72919.AC-12414 IC280-225-185 IC280-256-211 IC280-72919.AC-12413 IC280-324-186 IC280-72919.AC-10478 IC280-72918.AC-11321 IC280-57606 IC280-69605.AC-08327 IC280-69605 IC280-720-106 IC280-72919 IC280-72949 IC280-72918 IC280-72948 IC280-740-111 IC280-868-108 Test & Burn-In Pin Count Pitch 169 196 209 225 256 257 324 340 484 576 671 696 720 729 729 729 729 740 868 0.80 0.80 0.80 0.75 0.80 0.80 0.80 0.80 1.00 1.00 1.00 1.00 1.00 0.80 0.80 1.00 1.00 1.00 1.00 Grid Size 13 x 13 14 x 14 19 x 19 15 x 15 16 x 16 19 x 19 18 x18 22 x 22 22 x 22 33 x 33 34 x 34 38 x 38 38 x 38 27 x 27 27 x 27 27 x 27 27 x 27 38 x 38 38 x 38 IC Body Size 12 x 12 12 x 12 23 x 23 12 x 12 13 x 13 23 x 23 16 x 16 20 x 20 23 x 23 35 x 35 35 x 35 40 x 40 40 x 40 23 x 23 23 x 23 28 x 28 28 x 28 40 x 40 40 x 40 Socket Dimensions A 28.40 28.40 41.20 28.40 38.80 41.20 31.60 41.20 46.80 56.20 56.20 56.20 56.20 42.20 38.80 46.80 44.00 56.20 54.90 B 31.35 31.35 40.20 31.35 45.25 40.20 34.55 40.20 47.60 54.90 54.90 54.90 54.90 40.20 45.25 47.60 51.20 54.90 50.90 C 36.65 31.50 36.65 36.65 36.65 43.00 50.90 50.90 50.90 50.90 36.65 43.00 50.90 50.90 Lid IC Dim./ Type PCB's (see page) CS CS DL CS DL DL CS DL DL DL DL DL DL DL CS DL CS DL DL D-59 D-59 D-59 D-62 D-62 D-60 D-60 D-61 D-61 - SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER IC280 Series (Clamshell) Grid Size 15 x 15 Example Grids for FBGA / CSP / LGA 225 pins Top View from Socket IC280-225-185 (FBGA) Grid Size 16 x 16 256 pins IC280-256-211 (LGA) Grid Size 18 x 18 324 pins IC280-324-186 (CSP) SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Test & Burn-In IC280 Series (Clamshell) Example Grids for BGA Grid Size 27 x 27 Top View from Socket 729 pins IC280-72919 (BGA) 19.250.05 23.00 0.1 2.00 ref. 1.500.1 0.500.05 19.150.05 11.970.05 11.680.05 2-0.80x26=20.800.1 10.400.05 0.800.05 729-AE0.40 +0.1 0 23.500.1 4-AE2.20 +0.1 0 25.75 ref. 23.00 ref. 48.75 ref. 0.800.05 2 - 0.80x26=20.80 0.1 729-AE 0.500.05 Grid Size 27 x 27 792 pins IC280-72949 (BGA) 8.900.05 23.00 0.1 2.00 ref. 1.500.1 0.500.05 29.500.05 22.100.05 2-0.80x26=20.800.1 0.800.05 1.550.05 729-AE0.30 +0.1 0 23.500.1 Pos. pin 4-AE2.20 +0.1 0 Tapp. screw 0.800.05 2-0.80x26=20.80 0.1 729-AE 0.500.05 15.35 ref. 48.75 ref. Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER 0.800.05 10.40 ref 38.80 ref. +0.1 0 34.400.05 2-AE1.60 0.800.05 10.400.05 42.20 ref. +0.1 0 34.400.05 2-AE1.60 IC280 Series (Clamshell) Example Grids for BGA Grid Size 27 x 27 Top View from Socket 729 pins IC280-72918 (BGA) 28.00 0.1 1.30 ref. 0.800.1 0.500.05 13.100.05 1.000.05 20.700.05 19.300.05 17.000.05 15.500.05 2-1.00x26=26.000.1 729-AE0.40 +0.1 0 29.500.1 4-AE2.20 +0.1 0 1.000.05 2-1.00x26=26.00 0.1 729-AE 0.600.1 28.00 ref. 59.00 ref. 31.00 ref. Grid Size 27 x 27 792 pins IC280-72948 (BGA) 7.600.05 28.00 0.1 32.400.05 28.600.05 2-1.00x26=26.000.1 1.000.05 1.30 ref. 0.800.1 0.500.05 3.900.05 729-AE0.40 +0.1 0 29.500.1 Pos. pin 4-AE2.20 +0.1 0 Tapp. screw 14.90 ref. 1.000.05 2-1.00x26=26.00 0.1 729-AE 0.600.1 55.20 ref. 1.000.05 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER Test & Burn-In 44.00 ref. +0.1 0 39.400.05 2-AE1.60 1.000.05 13.000.05 46.80 ref. +0.1 0 39.400.05 2-AE1.60 IC280 Series (Clamshell) Grid Size 33 x 33 Example Grids for BGA 576pins Top View from Socket IC280-57606 (BGA) 35.000.2 2 - 1.00x32=32.00 1.00 21.81 max (1.11) (0.61) (0.50 ) 48.400.05 42.000.05 2 - 1.00x32=32.000.1 16.600.05 2 - AE1.50 0 +0.1 (1.20) 1.000.05 1.00x32=32.00 35.000.2 27.242 (56.20) 21.000.05 24.200.05 (30.90) (66.30) (35.40) 4 - AE2.20 0 +0.1 560 - AE0.60 576 - AE0.40+0.1 0 Grid Size 38 x 38 696pins IC280-69605 (BGA) 40.000.2 2 - 1.00x37=37.00 1.00 23.89 max (1.40 ) (0.50) 48.400.05 42.000.05 2 - 1.00x37=37.000.1 18.600.05 1.000.05 2 - AE1.50 0 Latch +0.1 1.00x37=37.00 696 - AE0.60 (39.70) (32.242) (21.73) AE5.00 (56.20) 696 - AE0.40 0 21.000.05 +0.1 (3.04) 24.200.05 (30.90) (66.30) (35.40) 4 - AE2.20 0 +0.1 (2.00) (2.00) (3.04) Test & Burn-In SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER |
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